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Semiconductor Crystals

Time:2020/11/02 丨 source:Fast Silver 丨 visit count:



SOI is to place a thin layer of silicon on an insulating substrate. Devices based on the SOI structure will essentially reduce junction capacitance and leakage current, increase switching speed, reduce power consumption, and achieve high-speed, low-power operation.


Product specification

Dimensions
4inch;6inch;8inch
Process
Smart cut; Bonding; SIMOX 
Type
N/P
Resistance
Custom
Top crystal thickness
      0.22~50μm
Buried oxide layer
0.4~4μm
Base layer thickness
100~500μm
TTV
<3μm
Particle
<10@0.3μm


Comparison of SIMOX, Bonding and Simbond three methods
 
Items
SIMOX
Bonding
Simbond
Wafers
One wafer
Two wafers
Two wafers
Wafer size
4', 5', 6' & 8'
4', 5', 6' & 8'
4', 5', 6' & 8'
Process
Two basic steps
Three basic steps
Four basic steps
SOI thickness
Thin/ultra-thin
Thick (>1.5um)
Thin/ultra thin/thick
BOX thickness
Thin (<400nm)
Thin/thick
Thin/thick
BOX property
Good/Average
Good
Good
SOI uniformity
Good
Average
Good
 
 
SOI application
 
SOI high-speed characteristics  Microprocessor, high-speed communication, three-dimensional image processing, advanced multimedia
SOI low voltage and low power consumption characteristics Mobile computers, mobile phones, portable electronic equipment, radio frequency integration, smart power devices and other fields that require low power consumption and fast heat dissipation, such as single-chip system SOC, micro satellites, etc.
SOI used in harsh environments High-temperature devices, high-voltage devices, satellites or other space applications, weapon control systems, etc.
SOI optical communication and MEMS applications As a structural material, it can be used to make silicon-based integrated optoelectronic devices, which are used in the interface of high-speed broadband Internet and other optical networks. In addition, SOI wafers are also widely used in the production of microelectromechanical system (MEMS) devices, such as sensors, etc.


Advantages of Fast Silver SOI wafers mainly have the following characteristics:

1. Improve running speed
Under a certain voltage, the operating speed of circuits built on Simao SOI materials is 30% higher than that of circuits built on ordinary silicon materials, which greatly improves the performance of microprocessors and other devices.

2. Reduce energy consumption
Fast Silver SOI material can reduce energy consumption by nearly 30%-70%, and is especially suitable for areas where energy consumption is relatively high.

3. Improve running performance
Fast Silver SOI material can withstand high temperatures as high as 350 degrees Celsius or even 500 degrees Celsius, which is especially suitable for equipment that must operate well in harsh environments.

4. Reduce package size
Fast Silver SOI material can meet the requirements of IC manufacturers for smaller and smaller products

Fast Silver offers various semiconductor crystals:SOI material, GaAs, ZnO, SiC, Ge and Si.
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