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Copper (Cu) Wires Evaporation Materials

Time:2019/06/11 丨 source:未知 丨 visit count:

99.9999% Copper (Cu) Wires for Thin Film Coating







Specifications
Material Type Copper
Symbol Cu
Purity 99.9999%
Size φ0.5mm
Package Unit 500g/ 1kg
Theoretical Density (g/cc) 8.92 Z Ratio 0.437
Color/Appearance Copper, Metallic E-Beam Excellent
Atomic Weight 63.546 Thermal Evaporation Techniques Boat:  Mo, W
Coil:  W
Basket:  W
Crucible:  Al2O3, Mo, Ta 
Melting Point (°C) 1,083 E-Beam Crucible Liner Material Graphite, Molybdenum
Coefficient of Thermal Expansion 16.5 x 10-6/K Temp. (°C) for Given Vap. Press. (Torr) 10-8:  727
10-6:  857
10-4:  1,017 
Thermal Conductivity 400 W/m.K Comments Adhesion poor. Use interlayer (Cr). Evaporates using any source material.
 


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